It is mainly used to test the resistance of materials to extremely high or low temperatures, which is similar to the situation of being in high or low temperatures discontinuously, and the thermal shock test allows various items to be tested in the shortest possible time. The changes or physical injuries caused by thermal epicenters are caused by changes in thermal expansion and contraction or other physical properties, and all kinds of products can be fully trusted by using PID systems. The effects of thermal shock include electrochemical changes caused by cracking or breaking layers and displacement of the finished product, and the PID system will make it easy for you to operate with full digital automatic control.
TR 6360 – High And Low Temperature Shock Test Chamber
GJB360.7-87 Temperature Shock Test;
GJB367.2-87 405 Temperature Shock Test;
SJ/T10187-91Y73 series temperature change test chamber--one box type;
SJ/T10186-91Y73 Series Temperature Change Test Chamber--Two Chambers;
Meets the standard IEC68-2-14_Test method N_ temperature change;
GB/T 2424.13-2002 Test Methods Temperature Change Test Guidelines;
GB/T 2423.22-2002 Temperature variation
High and low temperature thermal shock test chamber is widely used in electronic and electrical components, automation parts, communication components, auto parts, metals, chemical materials, plastics and other industries, national defense industry, aerospace, military industry, BGA, PCB substrates, electronic chip IC, semiconductor ceramics and polymer materials physical changes, testing the repeated tensile force of the materials to high and low temperatures and the chemical changes or physical damage of the product in thermal expansion and contraction, can confirm the quality of the product, from precision IC to heavy machinery components, It can be used as the basis or reference for the improvement of its products.
